Next-generation conveyance carrier “MagiCarrier” – KYOSYA CO.,LTD.

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KYOSYA CO.,LTD. exhibits Next-generation conveyance carrier “MagiCarrier” in
They introduce a conveyance carrier using the adhesion resin which is usable 1,000 times repeatedly and is strong in heat. It is used for FPC board implementation, microparts and board conveyance

For more details please visit Turn captions on for Chinese, Korean, French, German, Italian, Espanol, Portuguese.

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